✦ LIBER ✦
Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates
✍ Scribed by Fengqun Lang; Hiroshi Yamaguchi; Hiromichi Ohashi; Hiroshi Sato
- Book ID
- 107457315
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 717 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0361-5235
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