✦ LIBER ✦
Improved metal-dielectric adhesion for interconnect lines of MMICs and ICs: an experimental study
✍ Scribed by R. Gulati; B.K. Sehgal; H.S. Sharma; Seema Vinayak; Sindhu Dayal; A.A. Naik
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 841 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0921-5107
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