✦ LIBER ✦
Improved hybrid circuit assembly yields and reliability by glassivation of the semiconductor chip : B. C. Heap and S. A. France. Electrocomp. Sci. Technol. 4, 117 (1977)
- Publisher
- Elsevier Science
- Year
- 1978
- Tongue
- English
- Weight
- 97 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0026-2714
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