MOSFET devices with Ge channel and nitridation treatment using plasma immersion ion implantation (PIII) are studied in this work. Experimental results show that the electrical characteristics and reliability of Ge MOSFETs can be significantly improved by PIII nitridation. For instance, the mobility
Improved electrical characteristics and reliability of amorphous InGaZnO metal–insulator–semiconductor capacitor with high κ HfOxNy gate dielectric
✍ Scribed by Xiao Zou; Guojia Fang; Longyan Yuan; Xingsheng Tong; Xingzhong Zhao
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 809 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0026-2714
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✦ Synopsis
High j HfO x N y film was deposited on amorphous InGaZnO (a-IGZO) by radio-frequency reactive sputtering using an HfO 2 target in nitrogen plus argon ambience, the electrical characteristics and reliability of a-IGZO metal-insulator-semiconductor (MIS) capacitors were investigated. Experimental results indicate that the nitrogen incorporation into HfO 2 can produce a strong nitride interfacial barrier layer, thus lead to reducing the interface state density, suppressing the hysteresis voltage, and decreasing the gate-leakage current. Improved performance has been achieved for HfO x N y gate dielectric a-IGZO MIS capacitors, with a interface state density of 5.1 Â 10 11 eV À1 cm À2 , a gate-leakage current density of 3.9 Â 10 À5 A/cm 2 at V fb + 1 V, an equivalent permittivity of 24, and a hysteresis voltage of 105 mV. Moreover, the enhanced reliability of Al/HfO x N y /a-IGZO MIS capacitor is observed with a small degradation of electrical characteristics after a high field stressing at 10 MV/cm for 3600 s.
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