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Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu-plated layer on poly(ethylene terephthalate) by plasma treatment

✍ Scribed by Kyung Wha Oh; Dong Jun Kim; Seong Hun Kim


Publisher
John Wiley and Sons
Year
2002
Tongue
English
Weight
275 KB
Volume
84
Category
Article
ISSN
0021-8995

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