✦ LIBER ✦
Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures
✍ Scribed by D. Pan; I. Dutta; S. G. Jadhav; G. F. Raiser; S. Ma
- Book ID
- 107453385
- Publisher
- Springer US
- Year
- 2005
- Tongue
- English
- Weight
- 263 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0361-5235
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