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Implementation of tungsten metallization in multilevel interconnection technologies : Paul E. Riley, Thomas E. Clark, Edward F. Gleason and Marion M. Garver. IEEE Trans. Semicond. Mfg3(4), 150 (1990)


Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
127 KB
Volume
31
Category
Article
ISSN
0026-2714

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