Impact of the Unique Physical Properties of Copper in Silicon on Characterization of Copper Diffusion Barriers

✍ Scribed by A.A. Istratov; C. Flink; E.R. Weber

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 163 KB
• Volume: 222
• Category: Article
• ISSN: 0370-1972
• DOI: 10.1002/1521-3951(200011)222:1<261::aid-pssb261>3.0.co;2-5