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Impact of probe-to-pad contact degradation on the high frequency characteristics of RF MOSFETs and guidelines to avoid it

✍ Scribed by E. P. Vandamme; D. Schreurs; C. van Dinther


Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
141 KB
Volume
11
Category
Article
ISSN
1096-4290

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✦ Synopsis


Apparent degradation of the RF characteristics of silicon MOSFETs was observed under normal operating conditions. We show that it was not caused by intrinsic device degradation but originated from a degradation of the contact resistance between probe and bonding pad. Guidelines, not limited to MOSFETs only, are given that enable accurate S-parameter measurements for RF modelling and reliability assessment.