✦ LIBER ✦
Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process
✍ Scribed by Viet H. Nguyen; Roel Daamen; Romano Hoofman
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 394 KB
- Volume
- 76
- Category
- Article
- ISSN
- 0167-9317
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