Immersion Plating of Copper on Porous Silicon in Various Solutions

✍ Scribed by Ogata, Y.H. ;Sasano, J. ;Jorne, J. ;Tsuboi, T. ;Harraz, F.A. ;Sakka, T.

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 96 KB
• Volume: 182
• Category: Article
• ISSN: 0031-8965
• DOI: 10.1002/1521-396x(200011)182:1<71::aid-pssa71>3.0.co;2-o