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[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Packaging and board assembly technology trend and impact on the supply chain

✍ Scribed by Shangguan, D.

Book ID: 126762527
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 386 KB
Category: Article
ISBN-13: 9780780386204
DOI: 10.1109/HPD.2004.1346664

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