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[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Diamond film/alumina composites used as the packaging material in integrated circuits with ultra-high speed and high power

✍ Scribed by Yiben Xia, ; Linjun Wang,

Book ID: 126748131
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 434 KB
Category: Article
ISBN-13: 9780780386204
DOI: 10.1109/HPD.2004.1346730

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