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[IEEE Power Electronics in Transportation - Dearborn, MI, USA (24-25 Oct. 1996)] Power Electronics in Transportation - The effects of solder voids in the device to substrate interface for electric vehicle and other power applications

✍ Scribed by Viduya, L.A.; Gerbsch, E.W.; Hayes, M.B.; Campbell, R.J.; Nakanishi, T.G.

Book ID: 124080022
Publisher: IEEE
Year: 1996
Weight: 493 KB
Category: Article
ISBN-13: 9780780332928
DOI: 10.1109/PET.1996.565916

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