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[IEEE Japan International Electronic Manufacturing Technology Symposium - Kanazawa, Japan (June 9-11, 1993)] Proceedings of Japan International Electronic Manufacturing Technology Symposium - Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder

✍ Scribed by Zakel, E.; Azdasht, G.; Reich, H.

Book ID: 126721628
Publisher: IEEE
Year: 1993
Weight: 970 KB
Category: Article
ISBN-13: 9780780314320
DOI: 10.1109/IEMT.1993.639790

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