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[IEEE ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Seattle, WA, USA (27-30 May 1998)] ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) - Integrated flow-thermomechanical and reliability analysis of a densely packed C4/CBGA assembly

✍ Scribed by Hong, B.Z.; Yuan, T.-D.

Book ID: 126754856
Publisher: IEEE
Year: 1998
Weight: 996 KB
Category: Article
ISBN-13: 9780780344754
DOI: 10.1109/ITHERM.1998.689548

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