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[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Finite element modelling of a BGA package subjected to thermal and power cycling

✍ Scribed by Rodgers, B.; Punch, J.; Jarvis, J.

Book ID: 126654556
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 774 KB
Category: Article
ISBN-13: 9780780371521
DOI: 10.1109/ITHERM.2002.1012565

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