𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow

✍ Scribed by Dogruoz, M.B.; Urdaneta, M.; Ortega, A.

Book ID: 120553887
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 834 KB
Category: Article
ISBN-13: 9780780371521
DOI: 10.1109/ITHERM.2002.1012465

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Thermal/fluid performance evaluation of serrated plate fin heat sinks

✍ Shwaish, I.K.; Amon, C.H.; Murthy, J.Y. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 858 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

✍ Ho Chul Ryu, ; Duckjong Kim, ; Sung Jin Kim, 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 413 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Experimental study on laminar heat transfer in microchannel heat sink

✍ Poh Seng Lee, ; Juay Choy Ho, ; Hong Xue, 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 668 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - A CFD analysis of an electronic box

✍ Yeh, L.T. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 360 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Emerging MOSFET packaging technologies and their thermal evaluation

✍ Xuejun Fan, ; Haque, S. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 979 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - An integrated approach to flow, thermal and mechanical modeling of electronics devices

✍ Parry, J.; Marooney, C.; Warner, M.; Bailey, C.; Pericleous, K. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 774 KB