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[IEEE ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, USA (23-26 May 2000)] ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) - Finite-element modeling of thermal and thermomechanical behavior for three-dimensional packaging of power electronics modules

✍ Scribed by Wen, S.; Guo-Quan Lu,

Book ID: 125472179
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 497 KB
Edition: 2000
Category: Article
ISBN-13: 9780780359123
DOI: 10.1109/itherm.2000.866207

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