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[IEEE ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, USA (23-26 May 2000)] ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) - Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins

✍ Scribed by Moores, K.A.; Joshi, Y.K.; Schiroky, G.

Book ID: 115494385
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 433 KB
Edition: 2000
Volume: 0
Category: Article
ISBN-13: 9780780359123
DOI: 10.1109/itherm.2000.866219

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