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[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - Investigations on delay interconnect lines for high-speed designs with the numerical technique

✍ Scribed by Weiliang Yuan, ; Er-Ping Li,

Book ID: 127275060
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 324 KB
Edition: 2003
Volume: 2
Category: Article
ISBN-13: 9780780378353
DOI: 10.1109/isemc.2003.1236666

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