[IEEE International Symposium on Electromagnetic Compatibility - Anaheim, CA, USA (1992.08.17-1992.08.21)] International Symposium on Electromagnetic Compatibility - Finite Element Analysis Of The Electromagnetic Radiation From A VLSI Package Heatsink

✍ Scribed by Ladd, D.N.; Costache, G.I.

• Book ID: 126685030
• Publisher: IEEE
• Year: 1992
• Weight: 340 KB
• Category: Article
• ISBN-13: 9780780307131
• DOI: 10.1109/ISEMC.1992.626059