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[IEEE International Solid State Sensors and Actuators Conference (Transducers '97) - Chicago, IL, USA (16-19 June 1997)] Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97) - Advanced multichip module packaging of microelectromechanical systems

✍ Scribed by Butler, J.T.; Bright, V.M.; Comtois, J.H.

Book ID: 118128080
Publisher: IEEE
Year: 1997
Weight: 857 KB
Volume: 1
Category: Article
ISBN-13: 9780780338296
DOI: 10.1109/sensor.1997.613633

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