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[IEEE IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots - Nagoya, Japan (26-30 Jan. 1997)] Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots - Glass direct bonding technology for hermetic seal package

✍ Scribed by Ando, D.; Oishi, K.; Nakamura, T.; Umeda, S.

Book ID: 111974173
Publisher: IEEE
Year: 1997
Tongue: English
Weight: 604 KB
Volume: 0
Category: Article
ISBN-13: 9780780337442
DOI: 10.1109/memsys.1997.581800

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