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[IEEE IEEE Symposium on Ultrasonics, 2003 - Honululu, HI, USA (Oct. 5-8, 2003)] IEEE Symposium on Ultrasonics, 2003 - 3D finite element analysis of the Langevin transducer

✍ Scribed by Iula, A.; Cerro, D.; Pappalardo, M.; Lamberti, N.

No coin nor oath required. For personal study only.

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