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[IEEE IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP'94) - Arlington, TX, USA (23-26 Oct. 1994)] Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP'94) - A study of the interfacial breakdown in cable joints

✍ Scribed by Dang, C.; Fournier, D.

Book ID: 121354306
Publisher: IEEE
Year: 1994
Tongue: English
Weight: 253 KB
Category: Article
ISBN-13: 9780780319509
DOI: 10.1109/CEIDP.1994.592024

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