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[IEEE IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA (26-28 Oct. 1998)] IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) - Novel microstrip-to-stripline transitions for leakage suppression in multilayer microwave circuits

✍ Scribed by Kim, J.; Lee, H.-Y.; Itoh, T.

Book ID: 115489224
Publisher: IEEE
Year: 1998
Weight: 319 KB
Volume: 0
Category: Article
ISBN-13: 9780780349650
DOI: 10.1109/epep.1998.734036

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