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[IEEE IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society - Vienna, Austria (2013.11.10-2013.11.13)] IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society - Electro-thermal modeling of SiC power devices for circuit simulation

✍ Scribed by Shan Yin, ; Tao Wang, ; Tseng, K. J.; Jiyun Zhao, ; Xiaolei Hu,

Book ID: 124090314
Publisher: IEEE
Year: 2013
Weight: 494 KB
Category: Article
ISBN: 1479902241
DOI: 10.1109/IECON.2013.6699223

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