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[IEEE ICT 2005. 24th International Conference on Thermoelectrics, 2005. - Clemson, SC, USA (2005.06.19-2005.06.23)] ICT 2005. 24th International Conference on Thermoelectrics, 2005. - Grain structure and thermal transport properties of TiNiSn/sub 1-x/Sb/sub x/ and Ti/sub 1-y/Zr/sub y/NiSn/sub 0.95/Sb/sub 0.05/ half-Heusler alloys

✍ Scribed by Bhattacharya, S.; Skove, M.J.; Russell, M.; Tritt, T.M.; Xia, Y.; Ponnambalam, V.; Poon, J.; Thadhani, N.

Book ID: 118178871
Publisher: IEEE
Year: 2005
Weight: 202 KB
Volume: 0
Category: Article
ISBN-13: 9780780395527
DOI: 10.1109/ict.2005.1519957

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