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[IEEE Conference on Electrical Insulation and Dielectric Phenomena - Leesburg, VA, USA (29 Oct.-2 Nov. 1989)] Conference on Electrical Insulation and Dielectric Phenomena - Research for curing process of mica-containing epoxy resin-TOA system with dynamic dielectric spectroscopy

✍ Scribed by Chen Ling, ; Liu Guiyun,

Book ID: 124069597
Publisher: IEEE
Year: 1989
Weight: 318 KB
Category: Article
DOI: 10.1109/CEIDP.1989.69578

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