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[IEEE Comput. Soc. Press IEEE Multi-Chip Module Conference (MCMC-94) - Santa Cruz, CA, USA (15-17 March 1994)] Proceedings of IEEE Multi-Chip Module Conference (MCMC-94) - Laminated memory: a new 3-dimensional packaging technology for MCMs

✍ Scribed by Tuckerman, D.B.; Bauer, L.-O.; Brathwaite, N.E.; Demmin, J.; Flatow, K.; Hsu, R.; Kim, P.; Lin, C.-M.; Lin, K.; Nguyen, S.; Thipphavong, V.

Book ID: 121297555
Publisher: IEEE Comput. Soc. Press
Year: 1994
Weight: 677 KB
Category: Article
ISBN-13: 9780818655609
DOI: 10.1109/MCMC.1994.292526

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