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[IEEE APEC 2005. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition - Austin, TX, USA (6-10 March 2005)] Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. - Modeling and analysis of thermoelectric modules

✍ Scribed by Lineykin, S.; Ben-Yaakov, S.

Book ID: 115517079
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 669 KB
Volume: 3
Category: Article
ISBN-13: 9780780389755
DOI: 10.1109/apec.2005.1453336

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