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[IEEE APEC 2000 - Applied Power Electronics Conference - New Orleans, LA, USA (6-10 Feb. 2000)] APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058) - Packaging of integrated power electronics modules using flip-chip technology

✍ Scribed by Xingsheng Liu, ; Haque, S.; Jinggang Wang, ; Guo-Quan Lu,

Book ID: 118070529
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 813 KB
Edition: 2000
Volume: 1
Category: Article
ISBN-13: 9780780358645
DOI: 10.1109/apec.2000.826118

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