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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Exact Modelling of Stress Fields In Bimaterial Beams Using Readily Available Mathematical Software

✍ Scribed by Kinsella, C.; Moore, T.D.; Jarvis, J.L.

Book ID: 121318246
Publisher: IEEE
Year: 2006
Weight: 278 KB
Category: Article
ISBN-13: 9781424402755
DOI: 10.1109/ESIME.2006.1644036

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