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[IEEE 6th IEEE Workshop on Signal Propagation on Interconnects - Pisa (2002.5.12-2002.5.12)] Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects - Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method

✍ Scribed by Lee, Heeseok; Park, Charlie; Kam, Derek; Kim, Joungho

Book ID: 126737774
Publisher: IEEE
Year: 2002
Weight: 294 KB
Category: Article
ISBN-13: 9780780398214
DOI: 10.1109/SPI.2002.258271

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