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[IEEE 5th International Conference on Properties and Applications of Dielectric Materials - Seoul, South Korea (25-30 May 1997)] Proceedings of 5th International Conference on Properties and Applications of Dielectric Materials - A study on detection of defects in cable splice by analysis of ultrasonic signal

✍ Scribed by Chi-Young Park, ; Hee-Ro Kwak, ; Il-Keun Song, ; Sang-Jun Kim,

Book ID: 120564786
Publisher: IEEE
Year: 1997
Weight: 191 KB
Volume: 1
Category: Article
ISBN-13: 9780780326514
DOI: 10.1109/ICPADM.1997.617591

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