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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Flip chip as an enabler for MEMS packaging

✍ Scribed by Boustedt, K.; Persson, K.; Stranneby, D.

Book ID: 120256738
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 595 KB
Edition: 53
Category: Article
ISBN-13: 9780780374300
DOI: 10.1109/ECTC.2002.1008084

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