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[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Encapsulant characterization - valuable tools for process setup and failure analysis

โœ Scribed by Becker, K.-F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.-W.; Neumann-Rodekirch, J.


Book ID
126627530
Publisher
IEEE
Year
2002
Weight
939 KB
Category
Article
ISBN-13
9780780375673

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