𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Realization of a stackable package using chip in polymer technology

✍ Scribed by Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Bottcher, L.; Reichl, H.

Book ID: 118029743
Publisher: IEEE
Year: 2002
Weight: 742 KB
Volume: 0
Category: Article
ISBN-13: 9780780375673
DOI: 10.1109/polytr.2002.1020202

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - High volume printing technologies for the production of polymer electronic structures

✍ Huebler, A.; Hahn, U.; Beier, W.; Lasch, N.; Fischer, T. 📂 Article 📅 2002 🏛 IEEE ⚖ 446 KB

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Design of epoxy resins for UV laser cure

✍ Bayer, H. 📂 Article 📅 2002 🏛 IEEE ⚖ 629 KB

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Novel ultra-high dielectric constant polymer based composite for embedded capacitor application

✍ Yang Rao, ; Wong, C.P. 📂 Article 📅 2002 🏛 IEEE ⚖ 564 KB

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Behaviour of electroconductive polyaniline films used in highly sensitive ammonia sensors

✍ Hajdu, F. 📂 Article 📅 2002 🏛 IEEE ⚖ 577 KB

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Alternating current electrical properties of island aluminum thin films on polyimide substrates

✍ Fan Wu, ; Morris, J.E. 📂 Article 📅 2002 🏛 IEEE ⚖ 375 KB

[IEEE 2nd International IEEE Conference

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - Examination of solar cells and encapsulations of small experimental photovoltaic modules

✍ Saly, V.; Ruzinsky, M.; Packa, J.; Redi, P. 📂 Article 📅 2002 🏛 IEEE ⚖ 396 KB