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[IEEE 27th European Microwave Conference, 1997 - Jerusalem, Israel (1997.10.4-1997.10.6)] 27th European Microwave Conference, 1997 - T/R Module Packaging - a Challenge for Future System Design

✍ Scribed by Bosch, Wolfgang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 27th European Microwave Conference

✍ Sobhy, M. I.; Hosny, E. A.; Nasser, A. A. A. 📂 Article 📅 1997 🏛 IEEE ⚖ 391 KB

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✍ Geck, B.; Marquardt, J. 📂 Article 📅 1997 🏛 IEEE ⚖ 222 KB