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[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Stress migration in a copper - Aluminum hybrid technology

โœ Scribed by Christiansen, Cathryn; Chapple-Sokol, Jonathan; Coster, Michael; Hunt, Douglas; Lee, Tom C.; Murphy, William; Gambino, Jeffrey; Cooney, Edward; Kemerer, Timothy; Rassel, Richard; Stamper, Tony; U'Ren, Gregory; Lariviere, Stephane; Brandon, Stephane


Book ID
126653254
Publisher
IEEE
Year
2014
Weight
698 KB
Category
Article
ISBN
1479933171

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