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[IEEE 2014 15th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2014.03.3-2014.03.5)] Fifteenth International Symposium on Quality Electronic Design - Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation

✍ Scribed by Li, Ying-Chi; Tan, Sheldon. X.-D.; Yu, Tan; Huang, Xin; Wong, Ngai

Book ID: 126928890
Publisher: IEEE
Year: 2014
Weight: 886 KB
Category: Article
ISBN: 1479939455
DOI: 10.1109/isqed.2014.6783351

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