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[IEEE 2013 IEEE International Solid-State Circuits Conference (ISSCC 2013) - San Francisco, CA (2013.2.17-2013.2.21)] 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers - An AC-coupled hybrid envelope modulator for HSUPA transmitters with 80% modulator efficiency

✍ Scribed by Riehl, P.; Fowers, P.; Hao-Ping Hong, ; Ashburn, M.

Book ID: 125452944
Publisher: IEEE
Year: 2013
Weight: 307 KB
Category: Article
ISBN: 1467345148
DOI: 10.1109/isscc.2013.6487771

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