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[IEEE 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2013) - Chenzhen, China (2013.10.20-2013.10.23)] 2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Analysis of conduction mechanisms in alumina-filled epoxy resin under dc field and temperature

✍ Scribed by Yahyaoui, H.; Notingher, P.; Agnel, S.; Kieffel, Y.; Girodet, A.

Book ID: 125806286
Publisher: IEEE
Year: 2013
Weight: 969 KB
Category: Article
ISBN: 1479925977
DOI: 10.1109/CEIDP.2013.6748181

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