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[IEEE 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2013) - Chenzhen, China (2013.10.20-2013.10.23)] 2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

✍ Scribed by Tsekmes, I. A.; Kochetov, R.; Morshuis, P. H. F.; Smit, J. J.

Book ID: 121673863
Publisher: IEEE
Year: 2013
Weight: 616 KB
Category: Article
ISBN: 1479925977
DOI: 10.1109/CEIDP.2013.6748211

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