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[IEEE 2013 IEEE 10th International Conference on ASIC (ASICON 2013) - Shenzhen, China (2013.10.28-2013.10.31)] 2013 IEEE 10th International Conference on ASIC - TSVs-aware floorplanning for 3D integrated circuit

✍ Scribed by Jieliang Lu, ; Qin Wang, ; Jing Xie, ; Zhigang Mao,

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