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[IEEE 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Kanazawa (2013.5.26-2013.5.30)] 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Direct liquid cooling module with high reliability solder joining technology for automotive applications

โœ Scribed by Morozumi, Akira; Hokazono, Hiroaki; Nishimura, Yoshitaka; Ikeda, Yoshinari; Nabetani, Yoichi; Takahashi, Yoshikazu


Book ID
125435897
Publisher
IEEE
Year
2013
Weight
833 KB
Category
Article
ISBN
1467351369

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