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[IEEE 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC 2013) - Yokohama (2013.1.22-2013.1.25)] 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) - Stacking signal TSV for thermal dissipation in global routing for 3D IC

✍ Scribed by Po-Yang Hsu, ; Hsien-Te Chen, ; TingTing Hwang,

Book ID: 125506354
Publisher: IEEE
Year: 2013
Weight: 263 KB
Category: Article
ISBN: 1467330280
DOI: 10.1109/ASPDAC.2013.6509682

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