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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Simulation of deflection and stress for MEMS pressure sensor based on graphene

✍ Scribed by Jiang, Shengwei; Wang, Xuefang; Shi, Shuai; Yuan, Jiaojiao; Fang, Jing; Gao, Can; Liu, Sheng

Book ID: 125517177
Publisher: IEEE
Year: 2013
Weight: 395 KB
Category: Article
ISBN: 1479904988
DOI: 10.1109/ICEPT.2013.6756513

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