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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics

✍ Scribed by Zhang, Yu; Zhu, Pengli; Sun, Rong; Wong, Chingping

Book ID: 125512443
Publisher: IEEE
Year: 2013
Weight: 917 KB
Category: Article
ISBN: 1479904988
DOI: 10.1109/ICEPT.2013.6756479

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